PCB stands for Printed Circuit Board which is responsible for physically supporting the circuits and wiring of any electronic goodies. It has a print of circuits embedded on it which are done by a conducting material, so it seems that it is printed but the board is highly conductive and helps in making an electronic gadget work.
The sole purpose of PCB’s are to provide a solid base so that the wiring can sit on it perfectly and in the same manner it can be put inside a machine. Every electronic device from parts of a computer like graphic cards, mother boards, to home appliances like washing machines, microwaves, fridges and television are wired on a printed circuit board.
These are called “printed” because they have circuit marks, conductive traces and vias on them. A “via” (Latin for path or way) is an electrical connection between layers in a physical electronic circuit that goes through the plane of one or more adjacent layers. A “via” is a small opening in an insulating oxide layer that allows a conductive connection between different layers.
There are different types of PCB factory which provides PCB on the basis of different conductive material used:
• Silver PCB: it is used as silver is highly conductive and the coats the copper from getting oxidized.
• Electroless Nickel immersion gold PCB: It has two layer of metallic coating over catalyzed copper. Gold protects the nickel from oxidation during storage and provides low contact resistance.
• Organic Solderability Preservative PCB: protects copper from oxidizing before assembly and is very thin at the range of (100-4000 Angstroms).
• Sn/Pb Hot Air Solder Level (HASL) with SN100CL alloy PCB: contains 63% tin and 37 % lead. The common thickness ranges from .00003” - .0015” (30-1500 µ”) and the melting temperature is 183 degrees C.
• Lead-Free HASL: same process as the previous one, common alloys used are Sn/Cu/Co, Sn/Cu/Ni/Ge. It is slightly more uniform than the sn/pb one and has a higher melting temperature of 228 degrees C and thickness ranges from .0003”-.001” (300-1000 µ”).
• Immersion (White) Tin: it is formed with the intermetallic joint of copper/tin best used for backplane panels.
• Immersion Silver: it has the metallic solderability preservative with 8-15 micro inch of sheer silver and has an excellent solderability and can be easily bonded with aluminum wire.
• Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG): layer from 120 – 240 µ” of nickel is deposited on copper and is the fastest growing surface finish as it forms solder joints with SAC solders.
Read also: Support of a Printed Circuit Board
The sole purpose of PCB’s are to provide a solid base so that the wiring can sit on it perfectly and in the same manner it can be put inside a machine. Every electronic device from parts of a computer like graphic cards, mother boards, to home appliances like washing machines, microwaves, fridges and television are wired on a printed circuit board.
These are called “printed” because they have circuit marks, conductive traces and vias on them. A “via” (Latin for path or way) is an electrical connection between layers in a physical electronic circuit that goes through the plane of one or more adjacent layers. A “via” is a small opening in an insulating oxide layer that allows a conductive connection between different layers.
There are different types of PCB factory which provides PCB on the basis of different conductive material used:
• Silver PCB: it is used as silver is highly conductive and the coats the copper from getting oxidized.
• Electroless Nickel immersion gold PCB: It has two layer of metallic coating over catalyzed copper. Gold protects the nickel from oxidation during storage and provides low contact resistance.
• Organic Solderability Preservative PCB: protects copper from oxidizing before assembly and is very thin at the range of (100-4000 Angstroms).
• Sn/Pb Hot Air Solder Level (HASL) with SN100CL alloy PCB: contains 63% tin and 37 % lead. The common thickness ranges from .00003” - .0015” (30-1500 µ”) and the melting temperature is 183 degrees C.
• Lead-Free HASL: same process as the previous one, common alloys used are Sn/Cu/Co, Sn/Cu/Ni/Ge. It is slightly more uniform than the sn/pb one and has a higher melting temperature of 228 degrees C and thickness ranges from .0003”-.001” (300-1000 µ”).
• Immersion (White) Tin: it is formed with the intermetallic joint of copper/tin best used for backplane panels.
• Immersion Silver: it has the metallic solderability preservative with 8-15 micro inch of sheer silver and has an excellent solderability and can be easily bonded with aluminum wire.
• Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG): layer from 120 – 240 µ” of nickel is deposited on copper and is the fastest growing surface finish as it forms solder joints with SAC solders.
Read also: Support of a Printed Circuit Board
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